Wafer Connector

XH2.5 with buckle pin seat horizontal sticker 2PWB

TYPE-C manufacturer Shenzhen Bubujing Technology Co., Ltd. is a professional wafer connector manufacturer and custom manufacturer. It provides XH2.5 buckle pin seat horizontal sticker 2PWB wholesale and purchase, and the price is affordable. The products sell well in Beijing, Shanghai, Guangzhou, Shenzhen, Dongguan, Xiamen, Suzhou, Ningbo and other places.

The needle seat is composed of 4 modules of pitch, PIN position, structure and thickness. The pitch is divided into: 0.8mm, 1.0mm, 1.25mm, 1.5mm, 2.0mm, 2.54mm and 3.96mm, etc. PIN position: 2-30P; The structure is divided into: horizontal stickers, vertical stickers, straight inserts and curved inserts.

Connectors, also known as connectors, plugs and sockets. Electric current or signals are transmitted through electronic connectors. The function of the connector: a communication bridge is built between the circuits that are blocked or isolated in the circuit, so that the current flows and realizes the circuit Scheduled function. It makes the design and production process more convenient and flexible, and reduces production and maintenance costs. TYPE-C manufacturers improve the production process and simplify the assembly process of electronic products. It also simplifies the mass production process, easy to maintain and upgrade, Improved design flexibility.

Some important products generally need to ensure the quality of the needle seat, depending on the pulling force and plugging life of the needle seat, such as the wire-to-board connector needle seat.

One end of the needle socket is inserted on the board end, and the terminal connecting wires are connected one by one to make the circuit smooth. There are as many lines (lines) of wires as there are as many pins. In this way, two active devices that require a lot of effort to connect can be It's done in an instant, and it also saves space. So although it's a small needle holder, it's very functional.

The development of connectors will be miniaturization, high density, high speed transmission and high frequency.